Testing printed circuit board assembly (PCBA) chipsets requires a boundary scan test to ensure accurate and reliable testing. As technology evolves, chipset testing becomes more challenging due to the complex interconnects, limited access points, and increasing component density. Boundary scan testing, as defined by IEEE 1149.1 and IEEE 1149.6 standards, enables access to internal nodes of digital components that observe and control signals at various points within the device through a shift-register-based architecture. Manufacturers are required to design the PCBAs according to the standards. That means manufacturers must connect boundary test cells to each pin of the PCBA.
Manufacturers must test the PCBAs using the in-circuit tester (ICT) and boundary scan analyzer consecutively on the production floor. The process starts with ICT inspecting the high-speed PCBA traces for any shorts or open traces. Once the PCBA passes the ICT test, it proceeds to the boundary scan test, which assesses high-speed interconnects and dual in-line memory module (DIMM) memory. Boundary scan offers an overall picture of the functionality within the PCBA while also enabling easy identification of manufacturing problems in specific pins.
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