W3609B ADS Core, EM Design, RFIC Design Quad, Layout, RFPro, RF Ckt Sim, Sys-Ckt Verif, VTBs

The W3609B ADS Core, EM Design, RFIC Design Quad, Layout, RFPro, RF Ckt Sim, Sys-Ckt Verif, VTBs includes:

• 3D RF layout for multi-technology RF module and packaging design
• RFIC Packaging Design
• Module Level physical verification (DRC, LVS, LVL)
• HB, Envelope, Transient/Convolution nonlinear circuit simulators
• RFPro EM (Momentum and FEM) simulators
• Error Vector Magnitude (EVM) optimization at circuit level
• Comprehensive nonlinear stability analysis
• GoldenGate RFIC circuit simulator for Cadence Virtuoso or Synopsys Custom Compiler
• Virtual Test Bench libraries for Circuit-in-System verification against industry standards such as 5G, automotive radars and WIFI
• EM Design enables the creation and import of parameterized 3D components into ADS
  

ADS bundle for multi-technology RF module physical design, RFIC packaging design and module level verification (DRC, LVS, LVL) for error free assembly. RFPro EM simulators (Momentum and FEM) allows any selected electrical nets and components to be simulated without layout modifications or cookie cutting. Full suite of nonlinear circuit simulators enables RF modules to be designed for unconditional nonlinear stability, optimal modulated RF signal EVM performance at the circuit level. RFPro EM-circuit cosimulation ensures EM effects of packaging and interconnects are accounted for. The GoldenGate RFIC circuit simulator enables RFICs to be accurately simulated in Cadence Virtuoso or Synopsys Custom Compiler before ADS assembly of multi-technology RF modules and RFIC packaging design. Circuit-in-System verification test benches (VTBs) verify circuit performance compliance with a comprehensive library of industry standard system level specs such as 5G, automotive radars and WIFI to ensure consistent early design wins.

Critical Electrothermal Considerations

Electrothermal steady-state and transient simulation addresses electrothermal degradation of circuit performance such as: 

• AM-AM & AM-PM distortion leading to poor EVM & ACLR in modulated signals
• Device impedance shift causing impedance mismatch, reduced efficiency and reliability
• Thermal runaway failure from additive temperature rise when heat generated exceeds heat dissipated

Add the following elements to this bundle for electrothermal analysis:

• W3050E Electro-Thermal Simulator
  
• W3051E Electro-Thermal Dynamic Model Generator

Note: W3609B has been modified to remove 4096-QAM due to US export control ECCN 5D001. Please add the W3047E to your purchase to access 4096-QAM capability subject to relevant export control approvals in your geographic region.