Testing high-density multilayer printed circuit board assemblies (PCBAs) with limited test points involves a cluster testing method. Providing test access to all devices and components on a PCBA for electrical testing may be impractical while maintaining impedance control and signal integrity for high-speed data transmission. To overcome this limitation, engineers can group clusters of interconnected components for testing, achieving higher coverage with limited test resources.
The clustering process requires engineers with knowledge of PCBA layouts to group components on a single board, specify measurements, such as impedance between critical nodes, and identify the measurement of these active and passive components. Failing to do so would result in inconsistencies in measurement results, as the impedance produced by the active component would shift the measured value. Engineers need automated cluster formation and test plan generation.
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