Course

How to Integrate Multi-Technology RF Assemblies

Courses
9 items

Learn how mmWave designs at frequencies like 5G FR2 have circuit interconnects which face new challenges.

Learn:

Why RF modules operating at microwave and mmWave frequencies require low loss, low parasitic interconnects, and integrated packaging.
How PathWave advanced design system (ADS) and SmartMount enable a component designed in one technology to work in another technology.
PathWave Advanced Design System (ADS) with bundle W3606B

Lessons

Lesson 1 - Designing for Multi-Technology Assemblies

Introduces the concept of multi-technology assemblies and discusses the challenges involved in designing them. It covers topics such as materials selection, thermal management, and signal integrity.

Lesson 2 - Introduction and Integration Trends

Discusses the trends in wafer-level RF chip-scale packaging (WL-RF CSP). It covers topics such as the increasing use of heterogeneous integration, the development of new materials and processes, and the emergence of new applications.

Lesson 3 - Overview of Wafer Level Packaging Challenges

Explains the challenges involved in wafer-level packaging. It covers topics such as the need for high precision and repeatability, the potential for defects, and the need for a controlled environment.

Lesson 4 - Keysight UXR Channel Module

Design and implementation of the Keysight UXR channel module, a wafer-level RF CSP. It covers topics such as the module's architecture, its materials and processes, and its performance.

Lesson 5 - Integrated Phased Array

Discusses the design and implementation of the GlobalFoundries ADK integrated phased array on package, a wafer-level RF CSP. It covers topics such as the module's architecture, its materials and processes, and its performance.

Lesson 6 - Solving the Challenge: Demo on Keysight Assembly and EM Solution

Demonstrates the use of Keysight's Assembly and EM solution to design and simulate a wafer-level RF CSP. It covers topics such as the use of the solution to model the assembly process, to simulate the electromagnetic behavior of the package, and to analyze the results.

Brochures

PathWave Design Software

Gone are the days of simple design. Every year, designers push new limits: longer battery life, smaller components, higher levels of integration. With complex design comes new challenges. Designers spend hours setting up and running simulations. Mountains of data wait to be measured and analyzed. Engineers need to create workarounds to connect multiple design tools. Meanwhile, wireless standards are evolving quickly. To keep up with the strong demands of modern technology, designers need a new approach.

eBooks

Four Secrets to Mastering Millimeter-Wave Communications Circuit Design

Keysight has seen dramatic changes in mobile network devices and infrastructure design, development, and deployment in the transition from 4G to 5G. One substantial challenge affecting circuit design is frequencies extending into the 70 GHz millimeter-wave (mmWave) band. High millimeter-wave frequencies and the drive towards miniaturization directly impact the design of the circuits and systems.

Technical Overviews

5G Microwave-RF EDA Design Flow

PathWave Advanced Design System (ADS) addresses 3 critical requirements for 5G product development that had not been satisfactorily met by other EDA tools in the market before.

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