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PathWave ADS 2022 Update 1.0 Product Release
Highlights
The PathWave Advanced Design System (ADS) 2022 Update 1.0 product release includes new capabilities and enhancements for:
- File and Workspace Management Tools
- Design Editing and Layout
- Data Display
- Circuit Simulation
- High-Speed Digital (HSD) Design
- Electromagnetic (EM) Simulation
- Verification
- Design Kits
- Power Electronics
- Documentation
PathWave ADS 2022 Update 1.0 is available now!
PathWave ADS 2022 Update 1.0 continues to offer the industry’s most complete RF and microwave, High-Speed Digital, and Power Electronics design capabilities simulation software that you’ve come to love. This release delivers new and enhanced capabilities to improve productivity and usability for RF and Microwave circuit and system designers.
Watch some of our new videos on YouTube:
File and Workspace Management Tools
- New AEL API for archiving specified and reference workspaces
- New AEL API to display arbitrary textural information in Message List docking window for warnings or errors
Design Editing and Layout
- Enhanced layout translators – ODB++, ABL, BRD and Gerber–to preserve arcs in paths and traces
- Technology scale factor to scale multi-technology instances at the individual Smart Mount Pcell level
- Enhanced Design Differences tool to update common parameters for all the components using a single command
Data Display
- Display properties for Legend and Labels for swept values can now be configured in the Legend and Trace Options
- Limit Lines can now change color to indicate pass/fail state
- Limit Lines and Specification Masks can be dragged from Expression Manager and dropped into existing or to create new rectangular plots
Circuit Simulation
- New transistor models support for 1.4 of BSIM BULK 106.2 (tmemod=1.4) and HiSIM2 Version 3.11
- Josephson Junction Superconducting quantum device models with 3 terminals to observe or adjust internal quantum phase of device
- Electro-thermal (ETH) simulation now supported for Smart Mount
HSD Design
- SerDes TDR/TDT added to S-Parameter Toolkit
- Load configuration files for FlexDCA and Infiniium probes
- DDR/Memory Designer support for new DRAM, NAND Flash, GDDR6, GDDR6X, GDDR7
- Passivity enforcement accuracy enhancement for S-parameter models
- Conducted EMI analysis with dynamic switching VRM models for ripple and spectral content simulation
EM Simulation
- HFSS link option in RFPro solver
- Easier Port editing with drag & drop pin assignment in RFPro
- Edit 3D component parameters directly in RFPro for quick analysis
- Enhanced RFPro FEM Gen 2 solver accounts for conductivity, resistivity and surface roughness of sheet conductors
Verification
- Design Rule Check (DRC) adds 40 new rules including aspect ratio and center-point spacing; ehnaced with simplified syntax using single-word qualifiers
- DRC can run on LVS Device Recognition rules and can highlight device, pin and artwork layer DRC errors in the layout
- Layout Versus Schematic (LVS) identifies unmatched nets and component artwork can contain a pad stack with optional area pin
Design Kits
- Process Design Kit (PDK) Validator shows progress dialog on which tests are running and test cells have increased combinations of instance parameters
Power Electronics
- New AC-DC test benches for Voltage Spikes, Conducted & Radiated EMI
- Speed up 3D field loading while visualizing Far Field Results
- Speed up Circuit Simulation Dataset loading in Near & Far Field results
- Enhanced SPICE Netlist Translator for robust compatibility
Documentation
- Improved online help user interface (UI) with collapsible Table of Contents sidebar
- PDF generation of any portion of the documentation
- Product Release Switcher to view current help page in other supported releases
- Real time update of documentation for all supported releases