New Wire Bond Testing Solution Enhances Automotive IC Reliability
Case Studies
Amid rising demand for zero-defect automotive ICs, Keysight partnered with a leading OSAT to implement an advanced, capacitive-based wire bond testing solution. By leveraging Keysight’s Electrical Structural Tester (EST) with capacitive coupling technology, the customer achieved comprehensive defect detection that traditional ATE and X-ray methods missed. This breakthrough solution, capable of testing up to 72,000 ICs per hour, significantly reduced RMA costs and strengthened IC reliability, ensuring defect-free devices for the automotive industry.